
Cadence launches chiplet ecosystem for AI and HPC designs
Cadence announced a Chiplet Spec-to-Packaged Parts ecosystem aimed at simplifying development for customers building chiplets for physical AI, data center, and high-performance computing applications. Initial IP partners include Arm, Arteris, eMemory, M31 Technology, Silicon Creations, and Trilinear Technologies, with proteanTecs as the silicon analytics partner. Cadence is also working with














