Teradyne, Inc. announced the launch of its Titan HP system level test (SLT) platform, designed specifically for the artificial intelligence (AI) and cloud infrastructure markets. The solution is designed to meet the demands of smaller process nodes and emerging architectures in current technologies.
SLT has become an integral part of the high-volume manufacturing process, as the complex devices used in AI and cloud infrastructure deployments push the boundaries of power consumption and thermal output. Teradyne Titan HP, currently in production at a number of large customers, is purpose-built to test these devices in real-world conditions. Currently supporting up to two kilowatts of power, with a roadmap to support four kilowatts in the near future, customers can be assured that their investment today will meet the demanding requirements of tomorrow’s devices as well.
Teradyne Titan HP’s superior thermal control ensures devices meet rigorous quality standards at or above the expected yield. This includes:
- A multi-branch cold plate architecture, which cools both the device under test (DUT) and non-DUT components for comprehensive thermal management.
- Asynchronous cooling control with proportional, integral and derivative (PID)-tuned, per-site thermal control, which provides precise, efficient cooling to prevent overheating.
- A DUT heater option, which enhances the accuracy of automated temperature control (ATC) for more precise thermal testing.
Teradyne Titan HP is the world’s leading SLT solution, enabling mission mode testing for next-generation AI and cloud infrastructure devices. As part of Teradyne’s comprehensive portfolio of test equipment, which delivers superior test for every device across every insertion, Teradyne Titan HP ensures that our customers’ capital equipment investments are future-proofed for tomorrow’s evolving market demands.
For more information, visit teradyne.com/titan-hp.
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